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IS200BICMH1A | Printed circuit board assembly

The IS200BICMH1A is a GE printed circuit board component created by GE for the Mark VI series.

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IS200BICMH1A | Printed circuit board assembly

Product description
The IS200BICMH1A is a GE printed circuit board component created by GE for the Mark VI series. The Mark VI is part of the GE Speedtronic family, which has been used since the late 1960s to manage gas and steam turbine systems of all sizes and complexities. The product, although unique in its product number, is often referred to by the functional acronym “BICM”, which is embedded in the product number itself.

Hardware tips and specifications

Although there is a relative lack of extensive manual material for the IS200BICMH1A model, a simple analysis of the product’s baseplate and product number can yield a wealth of relevant and interesting information. For example, the above function acronym “BICM” in this product part number describes the function of this Mark VI series product as an IGBT gate driver card.

The structure of IS200BICMH1A PCB mainly includes insulating substrate, wire, electronic components and welding pad. The insulated substrate provides support and insulation, and the wire is the electrical connection line that connects the electronic components to each other and to the outside electrical. Electronic components include resistors, capacitors, transistors, etc., which are connected to the PCB by welding and other ways to achieve electrical functions. The pad is an important part of connecting electronic components and wires.

Depending on the application and function, IS200BICMH1A PCB can be divided into a variety of types such as single panel, dual panel and multi-layer board. The single panel has only one layer of wire, and all electronic components are installed on the same surface; The two panels have wires on both sides and are electrically connected through pins of electronic components; The multilayer board is composed of multiple layers of insulated substrate and wires, which can achieve more complex circuit functions and higher integration.

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