BKTEM-B2 film thermoelectric parameter test system
In order to solve the increasingly urgent energy crisis, a variety of new energy sources such as solar energy, wind energy and nuclear energy are constantly being developed and utilized. Make new energy
Use high quality energy saving materials.
Refrigeration and power generation systems made of thermoelectric materials are small in size, light in weight, without any mechanical noise and without causing any loops
Environmental pollution and many other advantages. Therefore, the study of thermoelectric materials is very important. In order to further improve the conversion efficiency of thermoelectric materials (thermoelectric、
Excellent value), the study of which slowly transferred from the block to the film material.
Technical principle
Dynamic method: Measure Seebeck coefficient
Add a small temperature difference of continuous change to both ends of the sample under the temperature field to be measured. By recording the change of temperature difference and thermoelectric potential at both ends of the sample,
Then, the temperature difference and thermoelectric potential are simulated to synthesize a straight line, and the slope of the straight line is the Seebeck coefficient of the material at this temperature field.
The resistivity was measured by four-wire method. Hardware features
? Seebeck coefficient and resistivity measurements specifically for thin film materials.
? Using dynamic method to measure Seebeck coefficient avoids the systematic error of static measurement in temperature difference measurement, and the measurement is more accurate.
? Using four-wire method to measure resistivity, the measurement is more stable and reliable.
Film thermoelectric parameter test system
Technical principle
Dynamic method: Measure Seebeck coefficient
Add a small temperature difference of continuous change to both ends of the sample under the temperature field to be measured. By recording the change of temperature difference and thermoelectric potential at both ends of the sample,
Then, the temperature difference and thermoelectric potential are simulated to synthesize a straight line, and the slope of the straight line is the Seebeck coefficient of the material at this temperature field.
The resistivity was measured by four-wire method. Hardware features
Seebeck coefficient and resistivity measurements specifically for thin film materials.
Using dynamic method to measure Seebeck coefficient avoids the systematic error of static measurement in temperature difference measurement, and the measurement is more accurate.
? Using four-wire method to measure resistivity, the measurement is more stable and reliable.
1. Function: The Seebeck coefficient and resistivity can be measured synchronously in the room temperature field;
2. Potential measurement: Acquisition system adopts commercial high resolution digital multimeter;
3. Temperature difference measurement: temperature difference accuracy control: +/-0.1K, temperature control rate: 0.02-50K /min; Temperature difference control: 0-80K;
4. Seebeck coefficient and resistance measurement methods: Seebeck coefficient – static DC method, multi-temperature difference method, resistivity – four-terminal method;
5. Measurement range and resolution of Seebeck coefficient: 1μV/K-25V/K; Measurement resolution: 10nV/K;
6. Resistivity measurement range and resolution: 0.2μOhmm-2.5Ohmm; Measurement resolution: 10nOhmm;
7. Measurement accuracy: Seebeck coefficient: +/ -7%, resistivity: +/ -10%;
8. Sample size: diameter or square 6-12mm, length 6-22mm, both front and back electrodes are acceptable;
9. Probe test spacing: 6, 8 mm, choose one;
10. External power supply: single-phase 220V, 50Hz;
11. Software: graphical interface, windows menu, data acquisition; Heating constant temperature cooling temperature programmed design; Easy to operate menu design, measurement results can txt, EXC