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IC200MDD845 | Combined type separate input/output module

Part number: IC200MDD845

Product description: Combined type separate input/output module

Brand: GE Intelligent Platform /GE Fanuc

Number of I/O channels: 24 (24)

Number of input channels: 16 (16)

Input signal, nominal 24 volts DC

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Product content

 

Part number: IC200MDD845

Product description: Combined type separate input/output module

Brand: GE Intelligent Platform /GE Fanuc

Number of I/O channels: 24 (24)

Number of input channels: 16 (16)

Input signal, nominal 24 volts DC

Product type: Hybrid module

 

The IC200MDD845 is a 24-point combined discrete I/O module for the VersaMax I/O family, formerly produced by GE Intelligent Platforms and now owned by Emerson Automation. The module has sixteen (16) 24 VDC positive logic inputs and eight (8) independently isolated Type A 2.0 amp relay contact outputs. The maximum backplane current consumption of this module is 270 mA.

The main responsibility of the IC200MDD845 input/output module is to interact the information inside the computer with the external environment. In the input phase, the module receives a signal from an external device, converts it through a specific circuit into a digital signal that the computer can understand, and transmits it to the computer host. In the output stage, the computer host sends the data that needs to be output to the external device to the input and output module, which then converts the digital signal into the format that the external device can understand through the corresponding circuit, and transmits it to the external device for display or printing.

For the combined discrete input/output module, the specific design and implementation of IC200MDD845 may vary due to different application requirements and technical standards. In general, modular input/output modules may integrate multiple input/output functions in a single module to improve the integration and flexibility of the system. Separate input/output modules may have different input/output functions designed in different modules to achieve higher modularity and maintainability.

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