Model: IS210BPPCH1AD
Function Description: I/O Pack processor board
Component type: IS210 Special component
Brand: GE

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The IS210BPPCH1AD is an I/O packet processor board manufactured by General Electric (GE). It is part of the Mark VIe turbine control system, which is widely used in industrial applications. The IS210BPPCH1AD is one of several BPPC boards available, each with subtle differences. This particular board is designed for the Mark VIe system and is not compatible with the similar Mark VIeS system.

Design and construction:

Installation: Each corner of the IS210BPPCH1AD board is drilled in the factory for installation. It uses brackets and screw holders to attach to larger circuit boards. These mounts are located near a circular cut on the long side of the board.
Double-sided design: The board is double-sided and uses surface mount technology (SMT) to maximize space efficiency.
Component layout:

Top:
Two Ethernet ports
Small inductors or chokes
Diodes, resistors, capacitors, transistors
Multiple integrated circuits
Multiple resistance network arrays
Bottom:
It is mainly occupied by capacitors, resistors and diodes

Hardware tips and specifications

Every corner of the IS210BPPCH1AD board is drilled through the factory. The board is mounted to a larger circuit board using a support with a screw mount. The screw mounting seat is located near the circular incision on the side of the longboard. The IS210BPPCH1AD is a dual panel that uses SMT technology to maximize space utilization. The top of the board includes two Ethernet ports, a small inductor or choke, diodes, resistors, capacitors, transistors, and multiple integrated circuits. It also has multiple arrays of resistor networks. The bottom surface is mainly occupied by capacitors, resistors and diodes.

The IS210BPPCH1AD is a dual panel with SMT technology for maximum space use. The top of the board includes two Ethernet ports, a small inductor or choke, diodes, resistors, capacitors, transistors, and multiple integrated circuits. It also has multiple resistor network arrays. The bottom surface is mainly occupied by capacitors, resistors and diodes.